Flexible electronics : from materials to devices
edited by Guozhen Shen, Zhiyong Fan
- New Jersey : World Scientific, c2016.
- vi, 467 p. : ill. ; 24 cm.
Chapter 1 Carbon Nanotube Flexible Electronics; 1. Introduction; 2. Solution-Processed TFTs using Semiconductor-enriched SWNTs; 2.1. Nanotube Separation and TFT Fabrication; 2.2. Electrical Characteristics; 2.3. Field-Effect Mobility; 2.4. N-type Nanotube TFTs; 2.5. Frequency Response; 3. Applications of Solution-Processed Carbon Nanotube TFTs in Flexible Electronics; 3.1. Integrated Circuits; 3.2. Conformal/Stretchable Electronics; 3.3. Display Electronics; 3.4. Electronic Skin; 3.5. Flexible Visible Light and X-ray Imager. 4. Low-Cost Process Scheme for Flexible Carbon Nanotube Electronics: Printing5. Conclusions and Outlook; Acknowledgments; References; Chapter 2 Nanomaterial-Based Flexible Sensors; 1. Introduction; 2. Flexible Sensor Applications; 3. Nanomaterial Patterning on Flexible Substrates; 4. Flexible Interconnection Layers; 5. Flexible Sensors; 5.1. Optical Sensors; 5.2. Strain Sensors; 5.3. Tactile Pressure Sensors; 5.4. Temperature Sensors; 5.5. Gas Sensors; 5.6. pH Chemical Sensors; 6. Flexible Sensor Integration; 6.1. Artifi cial Electronic Skin (e-skin). 6.2. Artifi cial Electronic Whisker (e-whisker)6.3. Clinical Applications; 6.4. Health Monitoring Devices; 7. Human-Interactive Flexible Sensors; 7.1. Pressure-light Responsive e-skin; 7.2. Smart Bandages; 8. Summary and Outlook; Acknowledgments; References; Chapter 3 Graphene: From Synthesis to Applications in Flexible Electronics; 1. Introduction; 2. Mechanical and Electrical Properties of Graphene; 2.1. Mechanical Properties; 2.2. Electrical Properties of Graphene; 3. Synthesis Methods; 3.1. CVD synthesis of Graphene on Transition Metals and Transfer Process. 3.2. Direct Synthesis of Graphene on Insulators4. Applications of Graphene in Flexible Electronics; 4.1. Flexible Memories; 4.2. Strain Sensors; 4.3. Graphene Flexible Transistors; 5. Summary and Conclusions; Acknowledgments; References ; Chapter 4 Integrating Semiconductor Nanowires for High Performance Flexible Electronic Circuits; 1. Introduction; 2. Requirements for Flexible Circuits; 2.1. Flexible Substrates; 2.2. Flexible Dielectrics; 2.3. Flexible Electrodes; 2.4. Flexible Active Matrix; 3. Progress of NW-Based Flexible Circuits; 3.1. Preparation and Characterization of NWs. 3.1.1. Top-Down Wet Chemical Etching3.1.2. Top-down RIE; 3.1.3. Bottom-Up Vapor Phase Growth; 3.1.4. Bottom-Up Liquid Phase Growth; 3.1.5. Characterization of NWs; 3.2. NW Alignment Technologies; 3.2.1. Grown in Arrays Directly; 3.2.2. Langmuir-Blodgett Technique; 3.2.3. Blown Bubble Film Technology; 3.2.4. Fluid Assisted Alignment; 3.2.5. Electric field assisted alignment; 3.2.6. Contact printing technology; 3.3. Integration into Flexible Logic Circuits; 3.3.1. Patterning on Plastics/Rigid Substrate and then Exfoliate; 3.3.2. Transfer Printing of the Fabricated Devices onto Plastics.
This book provides a comprehensive overview of the recent development of flexible electronics. This is a fast evolving research field and tremendous progress has been made in the past decade. In this book, new material development and novel flexible device, circuit design, fabrication and characterizations will be introduced. Particularly, recent progress of nanomaterials, including carbon nanotubes, graphene, semiconductor nanowires, nanofibers, for flexible electronic applications, assembly of nanomaterials for large scale device and circuitry, flexible energy devices, such as solar cells and batteries, etc, will be introduced. And through reviewing these cutting edge research, the readers will be able to see the key advantages and challenges of flexible electronics both from material and device perspectives, as well as identify future directions of the field.