Electronic enclosures, housings and packages
Frank Suli
- Duxford : Woodhead Publishing, c2019.
- ix, 569 p. : ill. ; 23 cm.
- Woodhead publishing series in electronic and optical materials .
Front Cover; Electronic Enclosures, Housings and Packages; Related Titles; Forthcoming; Electronic Enclosures, Housings and Packages; Copyright; Contents; 1 -- Ubiquitous products; 1 -- An overview of enclosures, housings, and packages; 1.1 A scenario from the world of enclosures; 1.2 Definition; 1.3 Introduction; 1.4 The public facade; 1.5 Labels; 1.6 Discipline; 1.7 The opportunity; 1.8 Tech triangle; 1.8.1 Fasteners; 1.8.2 Connector problems; 1.8.3 Heat management introduction; 1.9 Review; 1.10 Hot tips; References; 2 -- Technological innovation; 2.1 Significance; 2.2 Innovation periods 2.2.1 Prehistoric2.2.2 Antiquity; 2.2.3 Middle Ages; 2.2.4 First wave-mechanization; 2.2.5 Second wave-steam; 2.2.6 Third wave-electricity; 2.2.7 Fourth wave-computer; 2.2.8 Fifth wave-Internet; 2.2.9 Sixth wave-Nanotech; 2.3 Integration and reinterpretation; 2.4 Review method; 2.5 Disruptive technologies; 2.5.1 Nonlinear optics; 2.5.2 Spintronics; 2.5.3 Memristors; 2.5.4 2-D electronics; 2.5.5 Organic electronics; 2.5.6 Molecular electronics; 2.6 Microelectromechanical systems; 2.6.1 Developments; 2.6.2 Definitions; 2.6.3 Applications; 2.6.3.1 Automotive airbag sensor; 2.6.3.2 BioMEMS 2.6.3.3 Inkjet printer head2.6.3.4 Medical pressure sensor; 2.6.3.5 Microoptical-electromechanical systems; 2.6.3.6 Overhead projection display; 2.6.3.7 Radio frequency microelectromechanical system; 2.6.4 Miniaturization issues; 2.6.5 Industry challenges; 2.6.5.1 Education and training; 2.6.5.2 Design, simulation, and modeling; 2.6.5.3 Packaging and testing; 2.6.5.4 Standardization; 2.6.5.5 Manufacturing; 2.6.6 The future; 2.7 Technology review; 2.8 Hot tips; References; 3 -- Market segments; 3.1 Introduction; 3.2 Aerospace and defense; 3.2.1 Avionics; 3.2.2 Unmanned aerial vehicles 3.2.3 Defense applications3.2.4 Space applications; 3.3 Automotive; 3.3.1 In-vehicle systems; 3.3.2 Automated vehicle technologies; 3.3.3 Connected vehicle technologies; 3.4 Built environment (HVAC and vertical transport); 3.4.1 Light-emitting diodes; 3.4.2 Heating, ventilation, and air conditioning; 3.4.3 Elevators; 3.4.4 Smart home; 3.5 Chemicals and explosive environments; 3.6 Consumer electronics; 3.6.1 Displays; 3.6.2 Head-mounted displays; 3.6.3 Augmented reality; 3.7 Electrical; 3.8 Energy offshore (oil and gas); 3.9 Food, beverage, and tobacco; 3.10 Instruments; 3.11 Material handling 3.12 Medical device3.13 Off-road, tracked, and other transport applications; 3.14 Pharmaceuticals; 3.15 Robotics; 3.16 Review; 3.17 Hot tips; References; 4 -- Enclosure requirements; 4.1 Introduction; 4.2 Creating a functional requirement specification; 4.3 Introduction of the functional requirement specification; 4.4 ZZ introduction example; 4.4.1 Engineering procedures and administration; 4.5 Functional requirement specification overview; 4.6 Product overview example; 4.6.1 Frame and enclosure sizes; 4.6.2 Levels of functionality; 4.6.3 Cost; 4.6.4 Multisourcing; 4.6.5 Target dimensions.
Electronic Enclosures, Housings, and Packages consider the problem of heat management for electronics from an encasement perspective. It addresses enclosures and their applications for industrial electronics, as well as LED lighting solutions for stationary and mobile markets. The book introduces fundamental concepts and defines dimensions of success in electrical enclosures. Other chapters discuss environmental considerations, shielding, standardization, materials selection, thermal management, product design principles, manufacturing techniques, and sustainability. Final chapters focus on business fundamentals by outlining successful technical propositions and potential future directions.