Physical design for 3D integrated circuits 
 Physical design fort three-D integrated circuits 
Edited by Aida Todri-Sanial, Chuan Seng Tan ; Managing editor Krzysztof Iniewski 
 - Boca Raton :  CRC Press, Taylor & Francis Group, CRC Press is an imprint of the Taylor & Francis Group, an informa business,  c2016. 
 - xviii, 397 p. :  ill. (some col.) ;  26 cm. 
 - Devices, circuits, and systems .
<br/><br/>
<br/><br/> Electrical and computer engineers explain how to design three-dimensional electrical circuits effectively and optimally, and extol the benefits of such circuits. They cover three-dimensional integration overview, physical design methods for three-dimensional integration, reliability concerns for three-dimensional integration, and computer-aided design tools and future directions for three dimensional physical design. Among specific topics are an overview of physical design issues, power and signal integrity challenges in three-dimensional systems-on-chip, design methodology for three-dimensional power delivery networks, thermal modeling and management, and design challenges and solutions for monolithic circuits. 
<br/><br/><label>ISBN: </label>9781498710367 
<br/><br/><label>LCCN: </label>2015035061 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Three-dimensional integrated circuits--Design and construction
<br/><br/><label>Dewey Class. No.: </label>621.39/5