000			01801cam a2200253 a 4500
999			_c30025 _d30025
010			_a 2015035061
020			_a9781498710367
082	0	0	_a621.39/5
245	0	0	_aPhysical design for 3D integrated circuits _cEdited by Aida Todri-Sanial, Chuan Seng Tan ; Managing editor Krzysztof Iniewski
246	3		_aPhysical design fort three-D integrated circuits
260			_aBoca Raton : _bCRC Press, Taylor & Francis Group, CRC Press is an imprint of the Taylor & Francis Group, an informa business, _cc2016.
300			_axviii, 397 p. : _bill. (some col.) ; _c26 cm.
490	0		_aDevices, circuits, and systems
504			_aIncludes bibliographical references and index.
520			_aElectrical and computer engineers explain how to design three-dimensional electrical circuits effectively and optimally, and extol the benefits of such circuits. They cover three-dimensional integration overview, physical design methods for three-dimensional integration, reliability concerns for three-dimensional integration, and computer-aided design tools and future directions for three dimensional physical design. Among specific topics are an overview of physical design issues, power and signal integrity challenges in three-dimensional systems-on-chip, design methodology for three-dimensional power delivery networks, thermal modeling and management, and design challenges and solutions for monolithic circuits.
650		0	_aThree-dimensional integrated circuits _xDesign and construction _960700
700	1		_aTodri-Sanial, Aida, _eEdited by _960701
700	1		_aTan, Chuan Seng, _eEdited by _960313
700			_aIniewski, Krzysztof, _eEdited by _960702
856			_uhttps://uowd.box.com/s/06h7rrrj2mn21w4u8lp9vn1regntjnzk _zLocation Map