Electronic enclosures, housings and packages (Record no. 35219)
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| INTERNATIONAL STANDARD BOOK NUMBER | |
|---|---|
| International Standard Book Number | 9780081023914 |
| DEWEY DECIMAL CLASSIFICATION NUMBER | |
| Call number | 621.381046 SU EL |
| MAIN ENTRY--PERSONAL NAME | |
| Authors | Suli, Frank |
| TITLE STATEMENT | |
| Title | Electronic enclosures, housings and packages |
| Statement of responsibility, etc | Frank Suli |
| PUBLICATION, DISTRIBUTION, ETC. (IMPRINT) | |
| Place of publication | Duxford : |
| Publisher | Woodhead Publishing, |
| Date | c2019. |
| PHYSICAL DESCRIPTION | |
| Extent | ix, 569 p. : |
| Other Details | ill. ; |
| Size | 23 cm. |
| SERIES STATEMENT | |
| Series statement | Woodhead publishing series in electronic and optical materials |
| CONTENTS | |
| Contents | Front Cover; Electronic Enclosures, Housings and Packages; Related Titles; Forthcoming; Electronic Enclosures, Housings and Packages; Copyright; Contents; 1 -- Ubiquitous products; 1 -- An overview of enclosures, housings, and packages; 1.1 A scenario from the world of enclosures; 1.2 Definition; 1.3 Introduction; 1.4 The public facade; 1.5 Labels; 1.6 Discipline; 1.7 The opportunity; 1.8 Tech triangle; 1.8.1 Fasteners; 1.8.2 Connector problems; 1.8.3 Heat management introduction; 1.9 Review; 1.10 Hot tips; References; 2 -- Technological innovation; 2.1 Significance; 2.2 Innovation periods 2.2.1 Prehistoric2.2.2 Antiquity; 2.2.3 Middle Ages; 2.2.4 First wave-mechanization; 2.2.5 Second wave-steam; 2.2.6 Third wave-electricity; 2.2.7 Fourth wave-computer; 2.2.8 Fifth wave-Internet; 2.2.9 Sixth wave-Nanotech; 2.3 Integration and reinterpretation; 2.4 Review method; 2.5 Disruptive technologies; 2.5.1 Nonlinear optics; 2.5.2 Spintronics; 2.5.3 Memristors; 2.5.4 2-D electronics; 2.5.5 Organic electronics; 2.5.6 Molecular electronics; 2.6 Microelectromechanical systems; 2.6.1 Developments; 2.6.2 Definitions; 2.6.3 Applications; 2.6.3.1 Automotive airbag sensor; 2.6.3.2 BioMEMS 2.6.3.3 Inkjet printer head2.6.3.4 Medical pressure sensor; 2.6.3.5 Microoptical-electromechanical systems; 2.6.3.6 Overhead projection display; 2.6.3.7 Radio frequency microelectromechanical system; 2.6.4 Miniaturization issues; 2.6.5 Industry challenges; 2.6.5.1 Education and training; 2.6.5.2 Design, simulation, and modeling; 2.6.5.3 Packaging and testing; 2.6.5.4 Standardization; 2.6.5.5 Manufacturing; 2.6.6 The future; 2.7 Technology review; 2.8 Hot tips; References; 3 -- Market segments; 3.1 Introduction; 3.2 Aerospace and defense; 3.2.1 Avionics; 3.2.2 Unmanned aerial vehicles 3.2.3 Defense applications3.2.4 Space applications; 3.3 Automotive; 3.3.1 In-vehicle systems; 3.3.2 Automated vehicle technologies; 3.3.3 Connected vehicle technologies; 3.4 Built environment (HVAC and vertical transport); 3.4.1 Light-emitting diodes; 3.4.2 Heating, ventilation, and air conditioning; 3.4.3 Elevators; 3.4.4 Smart home; 3.5 Chemicals and explosive environments; 3.6 Consumer electronics; 3.6.1 Displays; 3.6.2 Head-mounted displays; 3.6.3 Augmented reality; 3.7 Electrical; 3.8 Energy offshore (oil and gas); 3.9 Food, beverage, and tobacco; 3.10 Instruments; 3.11 Material handling 3.12 Medical device3.13 Off-road, tracked, and other transport applications; 3.14 Pharmaceuticals; 3.15 Robotics; 3.16 Review; 3.17 Hot tips; References; 4 -- Enclosure requirements; 4.1 Introduction; 4.2 Creating a functional requirement specification; 4.3 Introduction of the functional requirement specification; 4.4 ZZ introduction example; 4.4.1 Engineering procedures and administration; 4.5 Functional requirement specification overview; 4.6 Product overview example; 4.6.1 Frame and enclosure sizes; 4.6.2 Levels of functionality; 4.6.3 Cost; 4.6.4 Multisourcing; 4.6.5 Target dimensions. |
| SUMMARY | |
| Summary | Electronic Enclosures, Housings, and Packages consider the problem of heat management for electronics from an encasement perspective. It addresses enclosures and their applications for industrial electronics, as well as LED lighting solutions for stationary and mobile markets. The book introduces fundamental concepts and defines dimensions of success in electrical enclosures. Other chapters discuss environmental considerations, shielding, standardization, materials selection, thermal management, product design principles, manufacturing techniques, and sustainability. Final chapters focus on business fundamentals by outlining successful technical propositions and potential future directions. |
| SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical Heading | Consumer electronics |
| SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical Heading | Electronics |
| ELECTRONIC LOCATION AND ACCESS | |
| Uniform Resource Identifier | https://uowd.box.com/s/9ubwod8ho3665dil1gj1heiuxc25pvkp |
| Public note | Location Map |
| MAIN ENTRY--PERSONAL NAME | |
| -- | 23760 |
| SUBJECT ADDED ENTRY--TOPICAL TERM | |
| -- | 23761 |
| SUBJECT ADDED ENTRY--TOPICAL TERM | |
| -- | 5511 |
| Lost status | Source of classification or shelving scheme | Damaged status | Not for loan | Permanent location | Current location | Shelving location | Date acquired | Source of acquisition | Full call number | Barcode | Date last seen | Price effective from | Koha item type | Public note |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| University of Wollongong in Dubai | University of Wollongong in Dubai | Main Collection | 2019-01-23 | AMAUK | 621.381046 SU EL | T0061361 | 2018-11-25 | 2018-11-25 | REGULAR | Jan2019 |