Physical design for 3D integrated circuits
Title By: Todri-Sanial, Aida [Edited by] | Tan, Chuan Seng [Edited by] | Iniewski, Krzysztof [Edited by]
Material type:
BookSeries: Devices, circuits, and systems.Publisher: Boca Raton : CRC Press, Taylor & Francis Group, CRC Press is an imprint of the Taylor & Francis Group, an informa business, c2016.Description: xviii, 397 p. : ill. (some col.) ; 26 cm.ISBN: 9781498710367Other title: Physical design fort three-D integrated circuits.Subject(s): Three-dimensional integrated circuits -- Design and constructionDDC classification: 621.39/5 Online resources: Location Map | Item type | Home library | Call number | Status | Date due | Barcode | Item holds |
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| REGULAR | University of Wollongong in Dubai Main Collection | 621.395 PH YS (Browse shelf) | Available | T0055084 |
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| 621.395 MA LO Logic and computer design fundamentals | 621.395 PE CI Circuit design with VHDL | 621.395 PE CI Circuit design with VHDL | 621.395 PH YS Physical design for 3D integrated circuits | 621.395 RO FU Fundamentals of logic design / | 621.395 RO FU Fundamentals of logic design / | 621.395 SH LO Logic circuit design |
Includes bibliographical references and index.
Electrical and computer engineers explain how to design three-dimensional electrical circuits effectively and optimally, and extol the benefits of such circuits. They cover three-dimensional integration overview, physical design methods for three-dimensional integration, reliability concerns for three-dimensional integration, and computer-aided design tools and future directions for three dimensional physical design. Among specific topics are an overview of physical design issues, power and signal integrity challenges in three-dimensional systems-on-chip, design methodology for three-dimensional power delivery networks, thermal modeling and management, and design challenges and solutions for monolithic circuits.