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Physical design for 3D integrated circuits Edited by Aida Todri-Sanial, Chuan Seng Tan ; Managing editor Krzysztof Iniewski

Contributor(s): Material type: TextTextSeries: Devices, circuits, and systemsPublication details: Boca Raton : CRC Press, Taylor & Francis Group, CRC Press is an imprint of the Taylor & Francis Group, an informa business, c2016.Description: xviii, 397 p. : ill. (some col.) ; 26 cmISBN:
  • 9781498710367
Other title:
  • Physical design fort three-D integrated circuits
Subject(s): DDC classification:
  • 621.39/5
Online resources: Summary: Electrical and computer engineers explain how to design three-dimensional electrical circuits effectively and optimally, and extol the benefits of such circuits. They cover three-dimensional integration overview, physical design methods for three-dimensional integration, reliability concerns for three-dimensional integration, and computer-aided design tools and future directions for three dimensional physical design. Among specific topics are an overview of physical design issues, power and signal integrity challenges in three-dimensional systems-on-chip, design methodology for three-dimensional power delivery networks, thermal modeling and management, and design challenges and solutions for monolithic circuits.
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Holdings
Item type Current library Call number Status Date due Barcode
REGULAR University of Wollongong in Dubai Main Collection 621.395 PH YS (Browse shelf(Opens below)) Available T0055084

Includes bibliographical references and index.

Electrical and computer engineers explain how to design three-dimensional electrical circuits effectively and optimally, and extol the benefits of such circuits. They cover three-dimensional integration overview, physical design methods for three-dimensional integration, reliability concerns for three-dimensional integration, and computer-aided design tools and future directions for three dimensional physical design. Among specific topics are an overview of physical design issues, power and signal integrity challenges in three-dimensional systems-on-chip, design methodology for three-dimensional power delivery networks, thermal modeling and management, and design challenges and solutions for monolithic circuits.

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