Advances in 3D integrated circuits and systems

Yu, Hao

Advances in 3D integrated circuits and systems Hao Yu, Chuan-Seng Tan - New Jersey : World Scientific, c2016. - xvi, 375 p. : ill. ; 24 cm. - Series on emerging technologies in circuits and systems .

Includes bibliographical references and index.

Authors Hao Yu and Chuan-Seng Tan present readers with a comprehensive introduction to the emerging technology of 3D integration, the electronic engineering aspect of this technology, and 3D integrated circuits. The authors cover this material by examining the three stages of device development using 3D integrated circuits and systems: device basics, system level management, and real designs. Also included are chapters covering the fabrication techniques employed in the construction of 3D TSV and 2.5D TSI; thermal, power, and I/O management; device modeling; physical designs; and a variety of other related subjects. Annotation ©2016 Ringgold, Inc., Portland, OR (protoview.com)

9789814699013

2015020144


Three-dimensional integrated circuits

621.3815