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Advances in 3D integrated circuits and systems Hao Yu, Chuan-Seng Tan

By: Contributor(s): Material type: TextTextSeries: Series on emerging technologies in circuits and systemsPublication details: New Jersey : World Scientific, c2016.Description: xvi, 375 p. : ill. ; 24 cmISBN:
  • 9789814699013
Subject(s): DDC classification:
  • 621.3815
Online resources: Summary: Authors Hao Yu and Chuan-Seng Tan present readers with a comprehensive introduction to the emerging technology of 3D integration, the electronic engineering aspect of this technology, and 3D integrated circuits. The authors cover this material by examining the three stages of device development using 3D integrated circuits and systems: device basics, system level management, and real designs. Also included are chapters covering the fabrication techniques employed in the construction of 3D TSV and 2.5D TSI; thermal, power, and I/O management; device modeling; physical designs; and a variety of other related subjects. Annotation ©2016 Ringgold, Inc., Portland, OR (protoview.com)
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Holdings
Item type Current library Call number Status Date due Barcode
REGULAR University of Wollongong in Dubai Main Collection 621.3815 YU AD (Browse shelf(Opens below)) Available T0055086

Includes bibliographical references and index.

Authors Hao Yu and Chuan-Seng Tan present readers with a comprehensive introduction to the emerging technology of 3D integration, the electronic engineering aspect of this technology, and 3D integrated circuits. The authors cover this material by examining the three stages of device development using 3D integrated circuits and systems: device basics, system level management, and real designs. Also included are chapters covering the fabrication techniques employed in the construction of 3D TSV and 2.5D TSI; thermal, power, and I/O management; device modeling; physical designs; and a variety of other related subjects. Annotation ©2016 Ringgold, Inc., Portland, OR (protoview.com)

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