Advances in 3D integrated circuits and systems
By: Yu, Hao
Title By: Tan, Chuan Seng
Material type:
BookSeries: Series on emerging technologies in circuits and systems.Publisher: New Jersey : World Scientific, c2016.Description: xvi, 375 p. : ill. ; 24 cm.ISBN: 9789814699013Subject(s): Three-dimensional integrated circuitsDDC classification: 621.3815 Online resources: Location Map
Summary:
Authors Hao Yu and Chuan-Seng Tan present readers with a comprehensive introduction to the emerging technology of 3D integration, the electronic engineering aspect of this technology, and 3D integrated circuits. The authors cover this material by examining the three stages of device development using 3D integrated circuits and systems: device basics, system level management, and real designs. Also included are chapters covering the fabrication techniques employed in the construction of 3D TSV and 2.5D TSI; thermal, power, and I/O management; device modeling; physical designs; and a variety of other related subjects. Annotation ©2016 Ringgold, Inc., Portland, OR (protoview.com)
| Item type | Home library | Call number | Status | Date due | Barcode | Item holds |
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| REGULAR | University of Wollongong in Dubai Main Collection | 621.3815 YU AD (Browse shelf) | Available | T0055086 |
Total holds: 0
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| 621.3815 SM AR Smart sensors and systems | 621.3815 SY ST System reduction for nanoscale IC design | 621.3815 TO DI Digital electronics: : | 621.3815 YU AD Advances in 3D integrated circuits and systems | 621.38150286 EW AS E-waste : | 621.38152 LI WI Wide bandgap semiconductor spintronics | 621.38152 SE MI Semiconductor devices in harsh conditions / |
Includes bibliographical references and index.
Authors Hao Yu and Chuan-Seng Tan present readers with a comprehensive introduction to the emerging technology of 3D integration, the electronic engineering aspect of this technology, and 3D integrated circuits. The authors cover this material by examining the three stages of device development using 3D integrated circuits and systems: device basics, system level management, and real designs. Also included are chapters covering the fabrication techniques employed in the construction of 3D TSV and 2.5D TSI; thermal, power, and I/O management; device modeling; physical designs; and a variety of other related subjects. Annotation ©2016 Ringgold, Inc., Portland, OR (protoview.com)